Hi-Rel Microelectronic Solutions

ES Components specializes in high-reliability (hi-rel) microelectronic components aimed at serving industries where performance and durability are critical, such as aerospace, defense, and automotive sectors. These components are designed to withstand extreme conditions and provide consistent operation over extended periods. Our product offerings often include integrated circuits, semiconductors, and other essential electronic parts that comply with rigorous industry standards. For tailored solutions, customers can rely on ES Components' expertise in providing reliable and innovative products to meet specific application requirements.


RAD Hard MOFETs

JANKC die for extreme reliability and enhanced radiation hardness in A&D applications with low MOQs

RAD Hard MOSFETs


MIL-PRF-123 Capacitors

123 equivalent PME MLCC’s with 0402 to 1825 sizes and 6.3-500v rating, 4000hr life test already complete

MIL-PRF-123 Capacitors


Thin-Film Substrates

High Power RF options using Alumina, SiO2, BeO, AIN, etc. with solid gold via process and high conductivity traces

Thin-Film Substrates


Custom Packaging

Turnkey hermetic Hi-Rel packaging for single or multiple chips using current or obsolete die

Custom Packaging

Space-Grade
Electronic
Components

Rad Hard MOSFETs and Analog IC’s

Rad Hard Bipolar Transistors
to 1MRAD Hi Dose Rate and 300KRAD Lo Dose Rate

Leo and Non-Rad Hard Equivalents For Lower Cost Applications

MIL-PRF-123 PME Capcaitors
Equivalent Extended Range Versions From 0402-2225 and 16V-500V

Thin Film Power and RF Substrates

Custom Hirel Packaging
Support MIL-PRF-19500, 38534, 38535 Requirements

Space-Grade Electronic Components

Literature

Markets Served/Custom Packaging/Quality

  • AEROSPACE / SPACE:

    Strict adherence to military standards, methods and performance specification, as well as detailed attention to Customer Drawings (SCDs).

    Follow ITAR /Export rules and adhere to all pertinent DFAR regulation.

    Additional screenings and proof of maximum reliability.

    • JANS / JANSR / JANSF qualified Components

    • Rad Tolerant Diodes, Transistors and MOSFETs

    • Low Earth Orbit (LEO) applications with lower Rad Tolerance and screening, at lower cost

    • Obsolescence / DMSMS Support, including extensive DIE inventory

    • Custom Hermetic Packaging available for qualified lots and Rad samples

    • Element Evaluation per class K of MIL-PRF-38534 and MIL-PRF-19500, including HTRB, Life Test, SEM, PIND, Electrical Test at Temperatures and Environmental screenings.

    • Wafer traceability for bare die

    • Support all Customer Source Control Drawings (SCD’s)

    • Custom Hermetic DIP / LCC / FP packaging to any Space Grade flow

    • Compliant MIL-PRF-123 and equivalent MLCC capacitors (Precious Metal Electrode)

    DEFENSE / MILITARY

    Strict adherence to military standards, methods and performance specification, as well as detailed attention to Customer Drawings (SCDs).

    Follow ITAR /Export rules and adhere to all pertinent DFAR regulation.

    Understand the importance and urgency of what we provide in this market.

    • JAN / JANTX / JANTXV qualified components

    • Obsolescence / DMSMS Support, including extensive DIE inventory

    • Element Evaluation per class H of MIL-PRF-38534 and MIL-PRF-19500, including HTRB, Burn-In, Electrical Test at Temperatures and Environmental screenings

    • Diffusion Lot traceability for bare die

    • Support all Customer Source Control Drawings (SCD’s)

    • Custom Hermetic DIP / LCC / FP packaging

    • Date Code sorting for COT’s package devices

    • COT’s Component up-screening

    MEDICAL

    Applications with long life cycle

    FDA Approval and absolute need for consistency

    • Implantable bare die components

    • Medical instrumentation components including Non-magnetic devices

    • Sensor components for application specific platforms

    • Element evaluation and process change control

    INDUSTRIAL

    Varying application with higher than commercial components’ reliability

    • Solar “Bypass” diodes with 20+ year reliability

    • “Super-Junction” high voltage / high current MOSFETs for Power Module applications

    • “Down Hole” components with 175°C and 200°C+ capability

    • High Energy “Braking” Power Resistors (including water cooled)

    • High Power Thin Film Substrates for power MCM applications

  • MIL-PRF-38535 Screen | MIL-PRF-19500 Screen |
    1N / 2N Arrays | Custom SCD Screen |
    Hermetic Packaging | Eutecic/Epoxy Attach |
    Au/Al Wire Bond |
    Obsolete Die Inventory

    ES Components offers fully certified manufacturing capabilities to deliver tailored packaging solutions that meet your unique requirements. Whether working from customer source control drawings (SCD) or navigating outdated datasheets, we ensure reliable and efficient solutions that meet industry standards and support your project needs.