"Silicon Carbide: Advancing Power Electronics for the Future"

Explore the fundamentals and history of Silicon Carbide (SiC) technology. Build a strong foundation and deepen your expertise in advanced semiconductors.

Transforming Power Electronics with Silicon Carbide

In the rapidly evolving field of power electronics, Silicon Carbide (SiC) is transforming the way industries operate, offering higher efficiency, durability, and performance compared to traditional silicon-based semiconductors. From electric vehicles (EVs) and aerospace to renewable energy systems and industrial automation, SiC’s exceptional properties—such as its ability to withstand high temperatures, voltages, and frequencies—are paving the way for next-generation technological advancements.

Why Silicon Carbide? The Science Behind the Breakthrough

Silicon Carbide’s superiority stems from its fundamental material properties, making it the preferred choice for high-performance power electronics. Here’s what sets SiC apart:

• Wide Bandgap – With a bandgap nearly three times that of silicon, SiC allows for higher electric field strength, enabling power devices to operate at greater efficiencies and voltages.

• High Thermal Conductivity – SiC dissipates heat much faster than silicon, allowing devices to operate at higher temperatures without degrading performance, making them ideal for compact, high-power applications.

• Chemical Inertness – Resistant to oxidation and chemical corrosion, SiC-based components excel in harsh industrial and aerospace environments.

• High Breakdown Voltage – SiC can withstand significantly higher voltages than silicon, enabling the development of thinner, more efficient power electronics with reduced energy losses.

These properties not only enhance performance but also enable smaller, lighter, and more efficient designs, making SiC crucial for high-power applications.

A Brief History: From Stardust to Semiconductors

The story of Silicon Carbide dates back over a century, with its first synthetic production in the late 1800s. However, naturally occurring SiC, known as moissanite, was initially discovered in meteorites, showcasing its extraterrestrial origins. On Earth, SiC was historically used as an abrasive material due to its hardness but later emerged as a promising semiconductor material with revolutionary potential.

Advancements in manufacturing techniques, such as the Lely method and chemical vapor deposition (CVD), have enabled the production of high-purity SiC wafers, which are now widely used in power electronics. This progress has allowed SiC to transition from a niche material to a dominant force in next-generation semiconductor technology.

The Growing Impact of SiC in Power Electronics

Electric Vehicles (EVs) and Transportation

SiC power electronics are transforming EV powertrains, inverters, and charging systems. With SiC-based components, EVs can achieve:

• Higher energy efficiency, leading to extended driving range.

• Faster charging times due to improved thermal management.

• Reduced weight and size, enhancing overall vehicle performance.

Leading EV manufacturers, including Tesla, Toyota, and BYD, have already integrated SiC technology into their systems, significantly improving vehicle efficiency and battery performance.

Renewable Energy and Smart Grids

SiC’s high efficiency is crucial for solar and wind energy systems, where power conversion and management play a pivotal role. SiC-based inverters and converters help:

• Reduce energy losses during power conversion.

• Enhance reliability in high-voltage applications.

• Improve grid stability, allowing for more efficient power distribution.

Aerospace and Defense

SiC’s ability to withstand extreme conditions makes it ideal for high-performance radar systems, satellite power management, and military applications. The U.S. Department of Defense and NASA are actively researching SiC’s potential for deep-space exploration and advanced weaponry systems.

Industrial Automation and High-Voltage Applications

SiC is reshaping industries that demand high voltage and efficiency, such as factory automation, robotics, and high-speed rail systems. Its superior durability and thermal properties contribute to more reliable and long-lasting systems in harsh industrial environments.

The Future of Silicon Carbide in Power Electronics

As demand for high-efficiency power electronics grows, SiC is poised to play a critical role in next-generation technologies. The material is expected to drive advancements in:

• 5G and telecommunications, improving energy efficiency and signal integrity.

• Next-generation computing, where high-frequency power devices are essential.

• Medical equipment, enhancing power management in life-saving devices.

Market analysts predict that the SiC semiconductor market will grow exponentially, with major investments from companies such as Wolfspeed, STMicroelectronics, ON Semiconductor, and Infineon Technologies. Researchers are also exploring gallium nitride (GaN) and SiC hybrid systems, which could further optimize power electronics in the future.

Conclusion

Silicon Carbide is more than just a semiconductor—it’s a catalyst for innovation in power electronics. With its unmatched efficiency, high-temperature tolerance, and superior voltage-handling capabilities, SiC is enabling the next era of electrification, automation, and sustainability.

For engineers, technologists, and innovators, mastering SiC’s fundamentals is essential to unlocking its full potential. As industries continue to push the boundaries of efficiency and performance, SiC is at the forefront of this technological revolution—driving the future of power electronics, one breakthrough at a time.

<<< Back To The Official Blog of ES Components

Revolutionizing Power Electronics with Microchip’s Next-Gen SiC Technology

In today’s high-performance industries, efficiency, reliability, and power density are critical. Whether designing cutting-edge electric vehicles, aerospace systems, industrial equipment, or medical devices, engineers are constantly searching for solutions that push the boundaries of innovation.

Enter Microchip’s Silicon Carbide (SiC) technology…a game-changer in power electronics. Engineered for demanding applications, SiC MOSFETs and Schottky Barrier Diodes (SBDs) offer a superior alternative to traditional silicon-based components, providing higher efficiency, lower losses, and unmatched durability.

Why Choose Microchip SiC?

Microchip’s SiC solutions provide industry-leading advantages that set them apart:

✅ Unmatched Efficiency for Maximum Performance

Traditional silicon-based power devices suffer from significant switching and conduction losses, reducing overall system efficiency. Microchip’s SiC MOSFETs and SBDs are designed with ultra-low switching losses, minimizing energy waste and maximizing output—an essential factor for high-power applications.

✅ Compact, Lightweight Designs

Size and weight are critical factors in industries like automotive, aerospace, and medical. With higher power density and reduced cooling requirements, Microchip SiC devices enable smaller, more lightweight power systems—making them ideal for compact designs that demand superior power handling.

✅ Superior Thermal Conductivity for Better Heat Dissipation

Heat management is a major challenge in high-power applications. Silicon Carbide boasts 3× better thermal conductivity than silicon, allowing for improved heat dissipation and reducing the need for bulky heat sinks and cooling systems. The result? Cooler, more efficient operation and longer component lifespan.

✅ Rugged and Reliable for Extreme Environments

Microchip’s SiC technology is designed to thrive under harsh conditions, making it the perfect choice for applications that demand high reliability. With the ability to operate at higher temperatures without degradation, these components ensure long-term durability in even the most challenging environments—from the battlefield to industrial automation systems.

✅ AEC-Q101 Qualified – Meeting Industry Standards

Reliability isn’t just a claim—it’s a guarantee. Microchip’s SiC MOSFETs and SBDs meet AEC-Q101 qualification standards, ensuring they are rigorously tested and proven for automotive and industrial applications. When you choose Microchip, you choose a product that meets the strictest quality benchmarks.

Applications: Powering the Future Across Industries

Microchip’s SiC technology is revolutionizing industries that demand high efficiency, reliability, and performance:

🚗 Automotive – Electric vehicles (EVs), charging infrastructure, and powertrain systems
🏭 Industrial – High-power motor drives, renewable energy systems, and grid infrastructure
🛩️ Aerospace & Defense – Avionics, radar systems, and military-grade power electronics
🏥 Medical – Advanced medical imaging, surgical equipment, and high-precision instruments

Whether designing for automotive electrification, energy-efficient industrial systems, or mission-critical aerospace applications, Microchip SiC is the power solution for the future.

Ready to Upgrade? ES Components Has Microchip SiC In Stock!

At ES Components, we understand that quality, availability, and support are just as important as performance. That’s why we proudly stock Microchip SiC Bare Die, ready to ship when you need them.

🔹 Reliable Supply Chain – Avoid long lead times with our ready-to-ship inventory
🔹 Made in the USA – Ensuring top-tier quality and compliance with industry standards
🔹 Trusted Partner – Supporting aerospace, military, medical, and industrial markets

Unlock the Full Potential of SiC with Microchip and ES Components

As industries move toward higher efficiency and smarter power solutions, Silicon Carbide is leading the charge. Don’t settle for outdated silicon-based components—upgrade to Microchip SiC today and experience unmatched power, efficiency, and reliability.

📦 Contact ES Components now to secure your Microchip SiC components!

<<< Back To The Official Blog of ES Components

What Are Electronic Component Packaged Devices or Integrated Circuit Packaging?

Reference: Wikipedia 

In very simple terms, Packaged Devices is nothing more than an encasement that surrounds the circuit device to protect it from physical impairment or corrosion. In addition, it also allows electrical contacts that are mounted on the device to connect to a printed circuit board

Short History: Early 1970’s through early 2000’s.

So how did all this stuff start with Packaged Devices?  The earliest integrated circuits were packaged in what are called “Ceramic Flat Packs”. These were a
Military standardized printed circuit board surface mount component packages or “Flat Packs”   The other type of packaging used in the 1970s, was called the
ICP (Integrated Circuit Package). After that, these “Packaged Devices” kept evolving as technology advanced. Commercial circuit packaging quickly moved to
DIP or Dual-In-Line Packaging made from ceramic and then later plastic.

Next came PGA or Pin-Grid Array and LCC, Leadless Chip Carrier. After that, Surface Mount Packaging appeared to be the next new thing. The electrical components could be mounted directly onto the surface of the printed circuit board. Then came the Small Outline Integrated Circuit that occupied an area about 30-50% less than the Dual In-Line Packaging.

Next was the area array package, that was a ceramic Pin Grid Array Package

Then there was the Ball Grid Array or BGA. but evolved into Flip-Chip Ball Grid Array (FCBGA) packages in the 1990s. FCBGA packages allow for much higher pin count than any existing package types. In an FCBGA package, the die is mounted upside-down (flipped) and connects to the package balls via a substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die periphery.

OPERATION PROPERTIES: (DIE)

Traces out of the die, through the package, and into the printed circuit board have very different electrical properties, compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself.

Recent developments consist of stacking multiple dies in single package called SiP, for System In Package, or three-dimensional integrated circuit. Combining multiple dies on a small substrate, often ceramic, is called an MCM, or Multi-Chip Module. The boundary between a big MCM and a small printed circuit board is sometimes blurry.

WHAT DOES THIS ALL MEAN TO A “NON-ENGINEER?”

Well, to help you when you are searching for these devices, here are some common Package Types and images of these Packaged Devices.

Are you soldering to the top contact or wire bonding?

This is a must if there are any power discrete devices on the BOM.  Many discrete die are available with either option. The rest are only offered with one or the other of these two options. If only solderable top metal is available, and there are no alternative devices, the die distributor can possibly offer a sub-assembly using a Copper or Molybdenum disk with suitable top plating to meet wire bond requirements.

How are you planning to attach the die?

The vast majority of power discretes are available from the manufacturer with solderable back metal only, some with either solderable or gold back metal. If the user is planning to use epoxy attach, it is highly recommended that they not use die with solderable metals. Gold back metal is recommended for either eutectic or epoxy attach. At ES Components we have developed and qualified the ability to remove solderable back metal from wafers and deposit gold for devices where this option is not available from the vendor. Silicon back die are generally epoxy-attached and if a eutectic attach is required, a gold alloy preform is needed.

How will you want this bare die packaged for delivery in full production?

Packaged parts are typically supplied in production quantities on tape-and-reel with nearly infinite shelf life. Waffle packs are the most common medium for shipping bare die, but high volume automatic assemblies are moving towards sawn wafer on film to reduce cost and enhance manufacturing throughput. However, sawn wafer on film has shelf life limitations which demand special management of the supply pipeline. A die distributor can manage the pipeline so that probed unsawn wafers are kept in stock in the appropriate environment and sawn wafers on film are limited to only those wafers needed for short-term production. If there is a delay in manufacturing, the unsawn wafer inventory remains pristine and the shelf life issue is confined to a small subset of the inventory.

Summary

By answering these questions at the time of initial contact and early in the design process, it’s possible to save the user time and money by avoiding the need to modify or redesign the function based on sample evaluation possibly weeks or even months later. We can also properly code the die part number to capture all the pertinent information for future reference.

<<< Back To The Official Blog of ES Components

Optimizing Bare Die Selection for Reliable Hybrid Microcircuits

Unless you have been doing this for a good number of years you will quickly find out that there is a lot more involved than just searching for a Part# on the Internet. It’s especially frustrating to find out that in a world of “packaged” semiconductors that Bare Die commerce is perceived as a bother. The trick is understanding the differences between packaged parts and bare die. 

What is Bare Die and how do I buy Bare Die? 

Manufacturers produce a wafer that yields the die. After testing the wafer, individual die are separated from the wafer and assigned a part number and then shipped to a bare die distributor. Here, samples from a die lot are packaged to expedite Lot Acceptance Testing (LAT). Additional testing is usually done through a method of Known Good Die (KGD).

First, find a trusted Bare Die supplier that can provide you with the components in die form. Their expertise and advice will help you in the buying process. You may need Certificates of Conformance, Lot Traceability, Source Control Drawings, Geometries, Specific Testing performed. It can be very confusing.

Manufacturers produce a wafer that yields the die. After testing the wafer, individual die are separated from the wafer and assigned a part number and then shipped to a bare die distributor. Here, samples from a die lot are packaged to expedite Lot Acceptance Testing (LAT). Additional testing is usually done through a method of Known Good Die (KGD).

At the distributor’s facility, the die is visually reinspected to make sure that the die that you purchase looks flawless and will function well. In some instances, additional electrical testing is also performed for screening of specific electrical parameters.  Current die geometries must be obtained and any changes that have occurred must be forwarded to the end customer for review and approval. Often times samples are required by the end customer. Depending on the device, the distributors can usually provide the required sample. Sometimes though, the part is not available from the manufacturer in die form, or if the manufacturer agrees to provide the part, the minimum purchase quantity may be much, much higher than the end customer requires. Always keep in mind that everything is NOT available in die form.

Specifying and obtaining the correct bare die to build hybrid microcircuits and multi-chip modules presents some specific problems. Dominant design factors here are hermetic sealing requirements, size, and weight. However, the special needs related to the supply of bare die continues to mystify much of the electronics community beyond the handful of hybrid manufacturers specifically focused on this market.

Most hybrids are designed around the characterization of packaged parts. Once samples are received, the function designer builds the breadboard, runs characterization data, and then asks the hybrid designers to create a hybrid or multi-chip module to simulate the function. Here is where the die distributor immediately begins to add value.

Taking the Bill Of Materials (BOM) from the customer, we immediately determine which of the requested parts are not readily available in die form or require added value processing. First, some semiconductor devices are not available as bare die because the manufacturer simply elects not to offer the device in die form. Many newer power discrete devices are assembled in packages that use a braised clip for the top contact attachment point. The top metal used to facilitate these packages is not suitable for wire bonding or soldering, so the manufacturer will not offer this die to the market.

In this era of large wafer diameters of 6-in. or 8-in. and larger, the manufacturer may elect not to 100 percent-probe smaller die at the wafer level. The manufacturer does sample probes only, and accepts the predicted yield loss during 100 percent test of the packaged part.

In some cases, parts that have no prior history in the die market may have prohibitively high minimum order requirements in die or wafer form from the manufacturer, making it impossible to sample or support prototype builds.

The die distributor can address each of these problems and either perform the required added value or recommend a list of alternatives that are more readily available. In the case where a manufacturer will simply not quote a bare die, the die distributor often has access to alternative sources that can offer die with similar functions.

Suitability for Wire Bonding

Where the top metal is not suitable for wire bonding, it is usually not difficult to find a similar device within the vendor portfolio that is offered in die form with the preferred metallization. In the case where 100 percent probe is not performed by the manufacturer, the die distributor can offer this service using in-house capabilities or outsourcing to an approved test lab. This also involves the distributor performing a Lot Acceptance Test (LAT) after probe, to provide objective evidence that the probe successfully met the specified requirements.

Stocking and Inventory Control

At ES Components, we have proactively identified a long list of popular devices throughout our line card and established an “off-the-shelf” inventory. This inventory is automatically replenished based on a predetermined min/max rather than market demand. An off-the-shelf part is immediately available for sampling and has virtually no Minimum Order Quantity (MOQ) when supporting prototype procurements. The products offered include a variety of analog micro-circuits and a compete portfolio of popular discrete die and thin film resistor chips. We use this preferred inventory to quickly offer the hybrid designer alternatives that are readily available and provide a cost-effective solution. If the customer is unable to use one of these devices, we then support the procurement of a different required device.

Are you soldering to the top contact or wire bonding?

This is a must if there are any power discrete devices on the BOM.  Many discrete die are available with either option. The rest are only offered with one or the other of these two options. If only solderable top metal is available, and there are no alternative devices, the die distributor can possibly offer a sub-assembly using a Copper or Molybdenum disk with suitable top plating to meet wire bond requirements.

How are you planning to attach the die?

The vast majority of power discretes are available from the manufacturer with solderable back metal only, some with either solderable or gold back metal. If the user is planning to use epoxy attach, it is highly recommended that they not use die with solderable metals. Gold back metal is recommended for either eutectic or epoxy attach. At ES Components we have developed and qualified the ability to remove solderable back metal from wafers and deposit gold for devices where this option is not available from the vendor. Silicon back die are generally epoxy-attached and if a eutectic attach is required, a gold alloy preform is needed.

How will you want this bare die packaged for delivery in full production?

Packaged parts are typically supplied in production quantities on tape-and-reel with nearly infinite shelf life. Waffle packs are the most common medium for shipping bare die, but high volume automatic assemblies are moving towards sawn wafer on film to reduce cost and enhance manufacturing throughput. However, sawn wafer on film has shelf life limitations which demand special management of the supply pipeline. A die distributor can manage the pipeline so that probed unsawn wafers are kept in stock in the appropriate environment and sawn wafers on film are limited to only those wafers needed for short-term production. If there is a delay in manufacturing, the unsawn wafer inventory remains pristine and the shelf life issue is confined to a small subset of the inventory.

Summary

By answering these questions at the time of initial contact and early in the design process, it’s possible to save the user time and money by avoiding the need to modify or redesign the function based on sample evaluation possibly weeks or even months later. We can also properly code the die part number to capture all the pertinent information for future reference.

<<< Back To The Official Blog of ES Components