EFI THIN FILM CHIP COMPONENTS

Substrate Materials: Silicon, Alumina, Quartz, BeO, AIN

Resistor Films: Tantalum Nitride, Nickel Chromium

Contact Metallizations: Wirebondable Gold, Wirebondable Aluminum, Solderable Gold, Solder Dipped

Case Sizes: Range From 015015 to 0808

Resistance Values: Range From 1 MΩ to 20 MΩ

TCR: As Low as ± 25 ppm /°C

Tolerance: As Low as ± 0,1 %

Capacitance Values: Range From 0.25 pF to 1000 pF

Tolerance As Low As 0.05 pF

MOS and MNOS: Dielectric Options

Inductance Values: Range From 3.9 nH to 30 nH In Increments

Vishay EFI Specializes In High Frequency Products

Measured Frequency Up To 20 GHz

High Frequency Products Available In Resistors, Capacitors, and Spiral Inductors

Vishay EFI Also Offers Custom-Designed Submount Options

Assembly Options: Wirebondable, Solderable, Epoxy-Attach

Capabilities: Side-Wall Patterning, AuSn, Au-Filled Vias, Edge Wraps, Air-Bridges, and Laser-Machined Custom Substrates

SPUTTERED METALS:

• Adhesion Layer - Chrome (Cr),
  Titanium Tungsten (TiW)

• Barrier Layer - Palladium (Pd),
  Nickel (Ni)

• Conductor Layer - Aluminum (Al),
  Gold (Au), Copper (Cu)

• Solder Layer - Gold Tin (AuSn)

PLATED METALS:

• Barrier Layer - Nickel (Ni)

• Conductor Layer - Gold (Au),
  Copper (Cu)

• High Current Conductor - Gold (Au),
  Copper (Cu)

SUBSTRATE MATERIALS:

• Alumina (Al203)

• Aluminum Nitride (AIN)

• Beryllium Oxide (BeO)

• Silicon (Si)

• Quartz (SiO2)

• Other: Titanates, Ferrites, Sapphire

VISHAY EFI ~ ~ CHIP RESISTORS
Vishay EFI offers a variety of sizes and solutions for chip and wire assembly needs. Vishay single value wire bondable chip resistors are available on silicon, alumina, or quartz. Silicon substrates offer the highest power handling while quartz and alumina substrates have lower parasitic capacitance between the resistors and mounting board. Single value chip resistors are available with a back contact option, which reduces the number of wire bonds from two to one. Ranging in case sizes of 0201 to 1206, the resistor chips offer wire bondable terminations in Au or Al with options for backside metallization for various attachment methods.
SEE DATA SHEETS

VISHAY EFI ~ ~ MICROWAVE, HIGH POWER
Vishay EFI high frequency products include chip resistors, resistor arrays and tapped resistors all on a alumina substrate and the spiral chip inductor on quartz. The chip resistors are available with wire bondable or solderable terminations which can also be used as a flip chip.  The microwave products provide excellent high-frequency response and are typically used in applications for Amplifiers, Oscillators, Attenuators and more. Please reference additional information in our High Frequency Brochure. The high power wire bondable resistor product families offer the highest power in a small footprint. These resistors are available with both back contact and top contact configurations. The power handling ratings range from 500mW up to 4 W of power. The high temperature wire bondable resistors are designed to operate in environments up to 250 °C SEE DATA SHEETS

VISHAY EFI ~ ~ CHIP CAPACITORS
Vishay EFI wire bondable Metal Oxide Silicon (MOS) / Metal Nitride Oxide Silicon (MNOS) capacitors offer a small size, thin film option. Vishay EFI manufactures top contact single value thin film chip capacitors with silicon dioxide and silicon nitride dielectric on a silicon substrate. The top termination is available as either sputtered aluminum or plated gold and the backside metal is sputtered gold for mounting with conductive epoxy or some solders.

EFI also produces binary MOS multi-value capacitor chips which allow the user many choices in value selection. Custom capacitor networks are another option, either by customer drawing or through collaboration with the Vishay EFI design team. SEE DATA SHEETS

VISHAY EFI ~ ~ SUBSTRATES
Vishay EFI offers a variety of substrates for custom thin film solutions. The three substrates mainly used in our custom solutions are Alumina (Al2O3), Aluminum Nitride (AlN) and Beryllium Oxide (BeO) either lapped, as-fired or polished surface finishes. Alumina is a cost-effective solution that is commonly used for its surface quality and high frequency performance.

For power applications and when high thermal conductivity is needed, AlN and BeO substrates are optimal. Important factors to consider when choosing a substrate include dielectric constant, surface finish, loss tangent, thermal conductivity, coefficient of thermal expansion and cost. Vishay EFI produces on substrates that range in thickness from 5 mils to 60 mils and range in size from 20 x 20 mils to 4.50 in x 4.50 in. SEE DATA SHEETS