• Higher Levels of Integration

• Reduced Substrate Size/Cost

• Reduced Assembly / Manufacturing Process Cost

• Faster Time to Market

• Better Product Value

• More Features Peer Bare Die Area & Weight Reduction

Using bare die assembly to replace traditional package based assembly processes is catching on rapidly. This is most notable in high volume applications where density is required and high yield bare silicon is implemented. The lower cost of ownership takes into consideration substrate, assembly, system test, equipment utilization, rework, and increased product value. In addition, the cost of a bare die product is typically lower than the package equivalent. Process simplification - With bumped bare die and flip-chip processing, the assembly flows are streamlined by reducing the number of process steps. These bare die advantages promote higher levels of integration using existing mature products, which leads to increased functionality per square area, and reduces costs. Additionally, performance improvements are achieved with no additional cost penalty. Integrating bare die for SiP (System-in-Package) solutions provides a benefit over both standard package solutions and SOC (System-on-Chip) solutions. As design cycle time requirements continue to shorten and product time to market becomes increasingly important, die for SiP solutions finds greater utility in meeting the designer's needs.

Reference: DieWafer.com